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 LESHAN RADIO COMPANY, LTD.
2-Input NOR Gate with Open Drain Output
with LSTTL-Compatible Inputs
L74VHC1GT03
The L74VHC1GT03 is an advanced high speed CMOS 2-input NOR gate with an open drain output fabricated with silicon gate CMOS technology. It achieves high speed peration similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation. The internal circuit is composed of three stages, including an open drain output which provides the ability to set output switching level. This allows the L74VHC1GT03 to be used to interface 5 V circuits to circuits of any voltage between V CC and 7 V using an external resistor and power supply. The device input is compatible with TTL-type input thresholds and the output has a full 5.0 V CMOS level output swing. The input protection circuitry on this device allows overvoltage tolerance on the input, allowing the device to be used as a logic-level translator from 3.0 V CMOS logic to 5.0 V CMOS Logic or from 1.8 V CMOS logic to 3.0 V CMOS Logic while operating at the high-voltage power supply. The L74VHC1GT03 input structure provides protection when voltages up to 7 V are applied, regardless of the supply voltage. This allows the L74VHC1GT03 to be used to interface 5 V circuits to 3 V circuits. The output structures also provide protection when V CC = 0 V. These input and output structures help prevent device destruction caused by supply voltage - input/output voltage mismatch, battery backup, hot insertion, etc. * High Speed: t PD = 3.6 ns (Typ) at V CC = 5 V * Low Internal Power Dissipation: I CC = 2 mA (Max) at T A = 25C * Power Down Protection Provided on Inputs * Pin and Function Compatible with Other Standard Logic Families * Chip Complexity: FETs = 62; Equivalent Gates = 16
MARKING DIAGRAMS
5 4 1 2 3
VPd
SC-88A / SOT-353/SC-70 DF SUFFIX Pin 1 d = Date Code
5 4
Figure 1. Pinout (Top View)
1 2 3
VPd
Figure 2. Logic Symbol
Pin 1 d = Date Code
TSOP-5/SOT-23/SC-59 DT SUFFIX
FUNCTION TABLE
PIN ASSIGNMENT 1 2 3 4 5 IN B IN A GND OUT Y V CC A L L H H Inputs B L H L H Output Y Z L L L
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet.
1/6
LESHAN RADIO COMPANY, LTD.
L74VHC1GT03
MAXIMUM RATINGS
Symbol V CC V IN V OUT I IK I OK I OUT I CC PD JA TL TJ T stg V ESD Parameter DC Supply Voltage DC Input Voltage DC Output Voltage Value - 0.5 to + 7.0 - 0.5 to 7.0 - 0.5 to 7.0 -0.5 to V cc + 0.5 -20 +20 + 25 +50 200 333 260 + 150 -65 to +150 >2000 > 200 N/A 500 Unit V V V mA mA mA mA mW C/W C C C V
V CC=0 High or Low State
Input Diode Current Output Diode Current V OUT < GND; V OUT > V CC DC Output Current, per Pin DC Supply Current, V CC and GND Power dissipation in still air SC-88A, TSOP-5 Thermal resistance SC-88A, TSOP-5 Lead Temperature, 1 mm from Case for 10 s Junction Temperature Under Bias Storage temperature ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Latch-Up Performance Above V CC and Below GND at 125C (Note 5)
I LATCH-UP
mA
1. Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute-maximum-rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 2. Tested to EIA/JESD22-A114-A 3. Tested to EIA/JESD22-A115-A 4. Tested to JESD22-C101-A 5. Tested to EIA/JESD78 RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit V CC DC Supply Voltage 2.0 5.5 V V IN DC Input Voltage 0.0 5.5 V V OUT DC Output Voltage 0.0 7.0 V TA Operating Temperature Range - 55 + 125 C t r ,t f Input Rise and Fall Time V CC = 3.3 0.3 V 0 100 ns/V V CC = 5.0 0.5 V 0 20
DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES
Junction Temperature C 80 90 100 110 120 130 140 Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4 9.4 4.2 2.0 1.0 NORMALIZED FAILURE RATE
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
2/6
LESHAN RADIO COMPANY, LTD.
L74VHC1GT03
DC ELECTRICAL CHARACTERISTICS V Symbol V IH Parameter Minimum High-Level Input Voltage Test Conditions
CC
T A = 25C Min 1.4 2.0 2.0 0.53 0.8 0.8 1.9 2.9 4.4 2.58 3.94 0.0 0.0 0.0 0.1 0.1 0.1 0.36 0.36
0.1
T A < 85C -55C1.0
(V) 3.0 4.5 5.5
Typ
Max
Max
Min 1.4 2.0 2.0
Max
Unit V
V IL
Maximum Low-Level Input Voltage 3.0 4.5 V IN = V IH or V IL I OH = - 50 A V IN = V IH or V IL I OH = -4 mA 5.5 2.0 3.0 4.5 3.0 4.5 2.0 3.0 4.5 3.0 4.5 0 to5.5 5.5
0
V 0.53 0.8 0.8 1.9 2.9 4.4 2.34 3.66 0.1 0.1 0.1 0.52 0.52
1.0
V OH
Minimum High-Level Output Voltage V IN = V IH or V IL
2.0 3.0 4.0
V
V OL
Maximum Low-Level Output Voltage V IN = V IH or V IL
I OH = -8 mA V IN = V IH or V IL I OL = 50 A V IN = V IH or V IL I OL = 4 mA
V
I IN I CC
I OPD
Maximum Input Leakage Current Maximum Quiescent Supply Current
Maximum Off-state Leakage Current
I OL = 8 mA V IN = 5.5 V or GND V IN = V CC or GND
V OUT = 5.5 V
A A
A
2.0
0.25
20
2.5
40
5.0
AC ELECTRICAL CHARACTERISTICS C load = 50 pF, Input t r = t f = 3.0 ns T A = 25C Symbol
t PZL
Parameter
Maximum Output Enable Time, Input A or B to Y
Test Conditions
V CC = 3.3 0.3 V C L = 15 pF R L = R I = 500 C L = 50 pF V CC = 5.0 0.5 V C L = 15 pF R L = R I = 500 C L = 50 pF V CC = 3.3 0.3 V C L = 50 pF R L = R I = 500 V CC = 5.0 0.5 V C L = 50 pF R L = R I = 500
Min
Typ
5.6 8.1 3.6 5.1 8.1 5.1 4
T A < 85C -55C to 125C Max Min Max Min Max Unit
7.9 11.4 5.5 7.5 11.4 7.5 10 9.5 13.0 6.5 8.5 13.0 8.5 10 11.0 15.5 8.0 10.0 15.5 10.0 10 pF ns
t PLZ
Maximum Output Disable Time
ns
C IN
Maximum Input Capacitance
C PD
Power Dissipation Capacitance (Note 6)
Typical @ 25C, V CC = 5.0 V 18
pF
6. C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I CC(OPR) = C PD x V CCx f in + I CC . C PD is used to determine the no- load dynamic power consumption; P D = C PD x V CC 2 x f in + I CCx V CC .
3/6
LESHAN RADIO COMPANY, LTD.
L74VHC1GT03
Figure 4. Output Voltage Mismatch Application
Figure 5. Switching Waveforms
C L = 50 pF equivalent (Includes jig and probe capacitance) R L = R 1 = 500 or equivalent R T = Z OUT of pulse generator (typically 50 )
Figure 6. Test Circuit
Figure 7. Complex Boolean Functions
3
Figure 8. LED Driver
Figure 9. GTL Driver DEVICE ORDERING INFORMATION Device Nomenclature Device Order Number
L74VHC1GT03DFT1 L74VHC1GT03DFT2 L74VHC1GT03DFT4 L74VHC1GT03DTT1 L74VHC1GT03DTT3
Logic Circuit Indicator
L L L L L
Temp Range Identifier
74 74 74 74 74
Technology
VHC1G VHC1G VHC1G VHC1G VHC1G
Device Function
T03 T03 T03 T03 T03
Package Type Package Tape and (Name/SOT#/ Suffix Reel Suffix Common Name)
DF DF DF DT DT T1 T2 T4 T1 T3 SC-70/SC-88A/ SOT-353 SC-70/SC-88A/ SOT-353 SC-70/SC-88A/ SOT-353 SOT-23/TSOPS/ SC-59 SOT-23/TSOPS/ SC-59
Tape and Reel Size
178 mm (7 in) 3000 Unit 178 mm (7 in) 3000 Unit 330 mm (13 in) 10,000 Unit 178 mm (7 in) 3000 Unit 330 mm (13 in) 10,000 Unit
4/6
LESHAN RADIO COMPANY, LTD.
L74VHC1GT03
PACKAGE DIMENSIONS
SC70-5/SC-88A/SOT-353 DF SUFFIX
G
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A-01 OBSOLETE. NEW STANDARD 419A-02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --- 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --- 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20
A
5
4
S
1 2 3
-B-
D 5 PL
0.2 (0.008)
M
B
M
N J C
DIM A B C D G H J K N S
H
K
SOLDERING FOOTPRINT*
0.50 0.0197
0.65 0.025 0.65 0.025 0.40 0.0157
1.9 0.0748
SCALE 20:1
mm inches
5/6
LESHAN RADIO COMPANY, LTD.
L74VHC1GT03
PACKAGE DIMENSIONS
SOT23-5/TSOP-5/SC59-5 DT SUFFIX
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. A AND B DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0_ 10 _ 0.0985 0.1181
D
5 1 2 4 3
S
B
L G A J C 0.05 (0.002) H K M
DIM A B C D G H J K L M S
SOLDERING FOOTPRINT*
1.9 0.074
0.95 0.037
2.4 0.094 1.0 0.039 0.7 0.028
SCALE 10:1
mm inches
6/6


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